AEC Documents

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The following documents have been established by the AEC Component Technical Committee to define common electrical component qualification requirements. These documents contain detailed qualification and requalification requirements and include unique test methods and guidelines for the use of generic data. Components meeting these specifications are suitable for use in the harsh automotive environment without additional component level qualification testing. Suppliers may advertise components meeting these specifications without restrictions, but the specifications cannot be changed without the approval of the Sustaining Members (currently Autoliv, Continental, Delphi, Johnson Controls, and Visteon).

Important: To view and download these documents: 1) Check the documents you wish to view; 2) Register your name and affiliation on the registration form below; 3) Click on the "View Selected Documents" button.

For each of the AEC-Q100, Q101 and Q200 documents, if you wish to download the complete document, choose the main bulleted item; if you wish only to download specific subsections of the document, choose any of the subsequent, indented items.

• Note: The AEC - Q100 Rev - G base document, Stress Qualification For Integrated Circuits, has been released below. The AEC Technical Committee is currently revising all referenced AEC test methods. Once this activity has been completed, the revised test methods and an updated complete "AEC - Q100 Rev - G" document (base document + AEC test methods) will be posted here to the AEC website. Please check back periodically for any updated documents.
• AEC - Q100 Rev - G base: Stress Qualification For Integrated Circuits (base document only with no test methods)
• AEC - Q100-001 - Rev-C: Wire Bond Shear Test
• AEC - Q100-002 - Rev-D: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q100-003 - Rev-E: Machine Model (MM) Electrostatic Discharge Test
• AEC - Q100-004 - Rev-C: IC Latch-Up Test
• AEC - Q100-005 - Rev-C: Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test
• AEC - Q100-006 - Rev-D: Electro-Thermally Induced Parasitic Gate Leakage Test (GL)
• AEC - Q100-007 - Rev-B: Fault Simulation and Test Grading
• AEC - Q100-008 - Rev-A: Early Life Failure Rate (ELFR)
• AEC - Q100-009 - Rev-B: Electrical Distribution Assessment
• AEC - Q100-010 - Rev-A: Solder Ball Shear Test
• AEC - Q100-011 - Rev-B: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC - Q100-012 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q101 Rev - C: Stress Test Qualification For Discrete Semiconductors (complete document with test methods)
• AEC - Q101 Rev - C base: Stress Test Qualification For Discrete Semiconductors (base document only with no test methods)
• AEC - Q101-001 - Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q101-002 - Rev-A: Machine Model (MM) Electrostatic Discharge Test
• AEC - Q101-003 - Rev-A: Wire Bond Shear Test
• AEC - Q101-004 - Rev-: Miscellaneous Test Methods
• AEC - Q101-005 - Rev-A: Charged Device Model (CDM) Electrostatic Discharge Test
• AEC - Q101-006 - Rev-: Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems


• AEC - Q200 Rev - C: Stress Test Qualification For Passive Components (complete document with test methods)
• AEC - Q200 Rev - C base: Stress Test Qualification For Passive Components (base document only with no test methods)
• AEC - Q200-001 - Rev-A: Flame Retardance Test
• AEC - Q200-002 - Rev-A: Human Body Model (HBM) Electrostatic Discharge Test
• AEC - Q200-003 - Rev-A: Beam Load (Break Strength) Test
• AEC - Q200-004 - Rev-: Measurement Procedures for Resettable Fuses
• AEC - Q200-005 - Rev-: Board Flex / Terminal Bond Strength Test
• AEC - Q200-006 - Rev-: Termanal Strength (SMD) / Shear Stress Test
• AEC - Q200-007 - Rev-: Voltage Surge Test


• AEC - Q001 Rev - C: Guidelines for Part Average Testing (provides guidelines for using statistical techniques and extended operating conditions to establish part test limits; this approach could be used to provide "Known Good Die.")



• AEC - Q002 Rev - A: Guidelines for Statistical Yield Analysis (provides guidelines for using statistical techniques to detect and remove abnormal lots of integrated circuits)



• AEC - Q003 Rev - : Guidelines for Characterizing the Electrical Performance of Integrated Circuit Products



• AEC - Q004 Proposed DRAFT: Zero Defects Guideline (describes a set of tools and processes which suppliers and users of integrated circuits can use to approach or achieve the goal of zero defects during a product's lifetime)
  
  
  NOTE: The proposed DRAFT of AEC-Q004 was made available for a 6-month industry review period, which expired on April 1, 2007. Now that the review period has expired, all received comments and suggestions are being reviewed by the Technical Committee and incorporated (where applicable) into a final version of the Q004 document. Check back periodically for the release of the updated document.


• Document Removed - ISO/TS-16949: Customer Specific Requirements - Semiconductor Commodity

  Notice from the AEC Technical Committee: Supplements to TS-16949 are not allowed by the governing body (IATF/IAOB), only customer specifics. The authors of the QS-9000 Semi Supplement modified the document to be fully aligned with the new TS document and published it as ISO/TS-16949: Customer Specific Requirements - Semiconductor Commodity. The AEC did not issue the document as a supplement, but only as a document that was available for anyone to adopt as their customer requirement for semiconductor suppliers. Thus, the AEC posted the document on the website allowing anyone to take it, use it as is, or use it as a starting point for their own customer requirements. While TS16949 is required, the details, including what to do for semiconductors, is left up to each individual user for their specific requirements. The AEC was unable to communize the specific requirements, the document became inactive, and the AEC Technical Committee elected to remove the document from the website.

• DEHist 2000.1030: DE Histogram - Excel Add-in

  NOTE: DE Histogram is an Excel add-in that may be used to statistically analyze any data set, and graphically present the distributions of each variable. This software may be used freely, but it is currently unsupported. The sharing of software or other experience does not imply its fitness for your purpose, nor imply or express any warranty.

• AEC - CDC : Certificate of Design, Construction and Qualification (as published in AEC - Q100 Rev - G)
  
  NOTE (dated October 5, 2007): This CDC form was revised to correct formatting errors that prohibited certain form fields from being properly completed. The errors have been corrected in the version currently posted on the AEC website.



• AEC - QTP: Qualification Test Plan (as published in AEC - Q100 Rev - G)



• AEC Component Technical Committee Charter - Rev-E



• AEC Membership Application - Rev-E

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